The performance of any electronic gadgets depends on the segments utilized as well as how well they are appended to their contact pad. Given the exactness with which the parts must be connected, special machines are required to perform this fragile task. The machines that are always present in any genuine electronic assembling company are the smt reflow ovens.
The ovens are intended to carry out reflow soldering; the system whereby some sticky paste of solder and flux is used to connect electrical parts to the contact cushions on a temporary basis awaiting permanent soldering. The next process is a step by step controlled heating that melts all the binds at their contact point with the mother board.
Thanks to this oven, surface mount (smt) components can be attached to the circuit board in a matter of minutes eliminating several labor hours that are necessary if other methods like individual joint soldering is used. The oven is specifically designed to be able to heat the surface melting the solder without damaging any of the electrical components. The typical reflow oven consists of four distinctive stages; preheat, the thermal soak, the reflow and the cooling zone.
In the preheat zone, the incline rate is secured. This is the rate of temperature rise per second. It is normally 1 to 3 degrees for every second. It should not surpass the most extreme incline as this can damage the parts or split the mother board. It can likewise prompt the scattering impact. The solvent in the mixture too begins to dissipate in the zone.
The thermal soak zone is the next step lasting for between sixty to one hundred and twenty seconds removing all the solder paste volatiles in the process. The flux segments also begin oxidation of the segment cushions and leads, a procedure known as flux initiation. The temperature must be correct, with low temperatures, flux fails to completely enact while high temperatures leads to spattering, balling or oxidation of the paste.
The reflow zone then takes over. In this zone, the highest possible temperature as determined by the component with the lowest temperature tolerance in the assembly is reached. The common peak is usually from 20 to 40 degree centigrade above liquidus.
Ultimately, the cooling zone is the last step. It is utilized to cool the prepared board in a controlled way setting all joints as required. In a proper manner, this stage should prevent any intermetallic formation or even the thermal shock. Faster cooling is however done to so as to accomplish fine grains. All in all, there is a need for efficient control system, something possible with most of the modern designs.
If the company intends to improve the efficiency of their production, it pays to buy a new reflow oven. They can be ordered online sometimes with very favorable discounts. The online orders should be done with a lot of care and caution. It is appropriate to fast carry out due diligence, go through the website of the sellers, gather all the information about the specific model to be purchased and talk to customers who have experience dealing with the store. This ensures that the company does not fall prey to substandard products or fraudulent deals as a whole.
The ovens are intended to carry out reflow soldering; the system whereby some sticky paste of solder and flux is used to connect electrical parts to the contact cushions on a temporary basis awaiting permanent soldering. The next process is a step by step controlled heating that melts all the binds at their contact point with the mother board.
Thanks to this oven, surface mount (smt) components can be attached to the circuit board in a matter of minutes eliminating several labor hours that are necessary if other methods like individual joint soldering is used. The oven is specifically designed to be able to heat the surface melting the solder without damaging any of the electrical components. The typical reflow oven consists of four distinctive stages; preheat, the thermal soak, the reflow and the cooling zone.
In the preheat zone, the incline rate is secured. This is the rate of temperature rise per second. It is normally 1 to 3 degrees for every second. It should not surpass the most extreme incline as this can damage the parts or split the mother board. It can likewise prompt the scattering impact. The solvent in the mixture too begins to dissipate in the zone.
The thermal soak zone is the next step lasting for between sixty to one hundred and twenty seconds removing all the solder paste volatiles in the process. The flux segments also begin oxidation of the segment cushions and leads, a procedure known as flux initiation. The temperature must be correct, with low temperatures, flux fails to completely enact while high temperatures leads to spattering, balling or oxidation of the paste.
The reflow zone then takes over. In this zone, the highest possible temperature as determined by the component with the lowest temperature tolerance in the assembly is reached. The common peak is usually from 20 to 40 degree centigrade above liquidus.
Ultimately, the cooling zone is the last step. It is utilized to cool the prepared board in a controlled way setting all joints as required. In a proper manner, this stage should prevent any intermetallic formation or even the thermal shock. Faster cooling is however done to so as to accomplish fine grains. All in all, there is a need for efficient control system, something possible with most of the modern designs.
If the company intends to improve the efficiency of their production, it pays to buy a new reflow oven. They can be ordered online sometimes with very favorable discounts. The online orders should be done with a lot of care and caution. It is appropriate to fast carry out due diligence, go through the website of the sellers, gather all the information about the specific model to be purchased and talk to customers who have experience dealing with the store. This ensures that the company does not fall prey to substandard products or fraudulent deals as a whole.
About the Author:
You can visit www.sikama.com for more helpful information about The Working Of SMT Reflow Ovens.
Aucun commentaire:
Enregistrer un commentaire